Chip Heat Recovery Water Cooling Plate Cooling Module
Brand CGRC
This liquid cooled server cold plate component is an advanced liquid cooled cooling solution designed for high-performance computing scenarios.
As the key node kit of the liquid cooling temperature control system in the computer room, the cold plate module adopts precision engineering design and high-quality material manufacturing, combined with our overall chip thermal management solution in the computer room, not only can accurately control the chip temperature, reduce energy consumption and generate additional thermal energy benefits.
1.Product characteristics
Efficient heat dissipation: Liquid cooling technology takes away the heat generated inside the server quickly through liquid circulation, which has higher heat dissipation efficiency than the traditional air-cooled heat dissipation method, and can ensure the continuous and stable operation of the server under high load.
Low noise design: The noise generated by the liquid cooling system is much lower than that of the traditional fan cooling system, providing users with a quieter working environment.
Energy saving and environmental protection: Liquid cooling technology has a higher energy efficiency ratio, reducing power consumption, while reducing the carbon emissions of the cooling system, in line with the development trend of green data centers.
Accurate temperature control: The cold plate is equipped with an intelligent temperature control system, which can monitor the temperature of the server in real time, and automatically adjust the liquid flow rate according to the temperature change to achieve accurate temperature control and ensure that the server runs in the best state.
Safe and reliable: Adopt high reliability design to ensure stable operation of cold plate in complex environment. At the same time, the cold plate adopts a sealed design to avoid the risk of liquid leakage causing damage to the server.
2. Application field
This liquid cooled server cold plate is suitable for various high-performance computing environments, such as cloud computing centers, big data processing centers, and high-performance computing clusters. Its efficient heat dissipation capacity and stable operating performance can meet the stringent requirements for server heat dissipation in these fields.
