AI Liquid Cooled Computing Power Server 2U

1. Cold Plate-Based Thermal Dissipation Architecture

Our Fluid-cooled server systems are engineered with an advanced cold plate-based thermal dissipation architecture, facilitating rapid and efficient heat transfer. This innovative design significantly enhances the thermal management of the AI Liquid-Cooled Compute Node, achieving a Power Usage Effectiveness (PUE) value as low as 1.05, thereby substantially reducing energy consumption. The high-efficiency cold plate system ensures up to 90% heat recovery, contributing to both energy savings and environmental sustainability. This aligns with green IT practices and reduces operational costs for your business. The integrated Liquid-cooled chip thermal regulation system in the AI accelerator server ensures that the server operates at optimal temperatures, further enhancing overall efficiency and reliability. The synergy between the cold plate-based thermal dissipation architecture and the Liquid-cooled chip thermal regulation system makes our Fluid-cooled server systems a superior choice for high-performance computing environments, ensuring consistent and reliable performance.

The cold plate-based thermal dissipation architecture, combined with the Liquid-cooled chip thermal regulation system, ensures that the AI Liquid-Cooled Compute Node can handle the most demanding workloads without thermal throttling. The AI accelerator server, with its advanced cooling technology, maintains peak performance even under high computational loads, making it ideal for data centers and high-performance computing (HPC) applications. The Fluid-cooled server systems, designed with the cold plate-based thermal dissipation architecture, provide a robust and efficient solution for managing the thermal output of the AI Liquid-Cooled Compute Node, ensuring long-term stability and reliability.

2. Patent Leak-Proof Design

The unique patented leak-proof technology in our Fluid-cooled server systems employs indirect cooling to effectively prevent direct contact between the coolant and electronic components, thereby minimizing the risk of corrosion. This robust leak-proof design provides a strong guarantee for the long-term stable operation of the AI accelerator server. The AI Liquid-Cooled Compute Node is meticulously engineered to ensure that you do not need to worry about equipment damage caused by coolant leaks, providing peace of mind and reducing maintenance overhead. The integrated Liquid-cooled chip thermal regulation system, combined with the leak-proof design, ensures that the AI Liquid-Cooled Compute Node remains reliable and durable, even under the most demanding conditions.

The cold plate-based thermal dissipation architecture, coupled with the leak-proof technology, ensures that the Fluid-cooled server systems maintain their integrity and performance over time, offering a secure and reliable solution for your data center. The AI accelerator server, with its advanced Liquid-cooled chip thermal regulation system, is designed to operate reliably in mission-critical environments, where downtime is not an option. The Fluid-cooled server systems, with their cold plate-based thermal dissipation architecture, provide a high level of protection against potential coolant leaks, ensuring that the AI Liquid-Cooled Compute Node remains fully operational and protected from any potential damage.

3. High Scalability

Our Fluid-cooled server systems are designed to flexibly adapt to a wide range of chip models, whether they are common mainstream chips or specific high-performance chips. This high scalability allows the AI Liquid-Cooled Compute Node to be perfectly compatible with a variety of computing requirements, giving you the flexibility to grow your business and upgrade your technology as needed. The AI accelerator server, equipped with a sophisticated Liquid-cooled chip thermal regulation system, ensures that the server maintains optimal performance, regardless of the type of chip or the complexity of the workload. The cold plate-based thermal dissipation architecture supports this scalability, ensuring that the Fluid-cooled server systems can handle increasing computational demands.

The adaptability of the AI Liquid-Cooled Compute Node, combined with the Liquid-cooled chip thermal regulation system, makes it an ideal choice for businesses looking to future-proof their infrastructure and meet evolving computing needs. The Fluid-cooled server systems, with their cold plate-based thermal dissipation architecture, provide a versatile and robust solution for a wide array of applications, from general-purpose computing to specialized AI workloads. The AI accelerator server, with its advanced cooling technology, ensures that the Fluid-cooled server systems can scale seamlessly, supporting the most demanding workloads and delivering consistent performance.

4. High Stability

Our Fluid-cooled server systems are carefully designed and optimized to operate at optimal operating temperatures, consistently maintaining superior computing power. The AI Liquid-Cooled Compute Node, featuring a Liquid-cooled chip thermal regulation system, ensures that the server remains stable and reliable, even when handling complex and high-intensity computing tasks. Whether it's processing large datasets, running intensive simulations, or performing real-time analytics, the AI accelerator server provides solid support for your business continuity and the accuracy of data processing. The cold plate-based thermal dissipation architecture, combined with the advanced cooling technology, guarantees that your critical applications run smoothly and efficiently, without any compromise on performance.

The high stability of the AI Liquid-Cooled Compute Node, coupled with the advanced cooling technology, ensures that your data center operations are always at their peak, delivering consistent and reliable results, and supporting the most demanding workloads with ease. The Fluid-cooled server systems, with their cold plate-based thermal dissipation architecture, provide a stable and efficient environment for the AI accelerator server, ensuring that it can handle the most challenging tasks without interruption. The integration of the Liquid-cooled chip thermal regulation system ensures that the AI Liquid-Cooled Compute Node remains at the forefront of performance, reliability, and efficiency, making it a trusted solution for your high-performance computing needs.